Embedded OTP Applications

 

Many applications and market segments can realize the benefits Kilopass’s XPM technology provides for IC and SoC developers. The secure, reliable, one-time programmable NVM adds more convenience to the chip design and lowers
the device cost.


Kilopass XPM Advantages

  • Low Cost
  • Standard Logic CMOS
  • Physical Layer Security
  • Ease of Implementation
  • High Density
  • Qualified (3 Lots) for Volume Production
  • High Yield and High Reliability
  • Supports Low Power and High Performance Process Technologies -180nm down to 40nm

 

Market Applications Key Usage Benefits
Conditional Access, ePayment, Mobile Phone Security Chip ID, Encryption Key, Anti-piracy codes, Certifications, IMEI/DRM
  • High Security Level
  • Small Area
MCU, embedded SoC Chip Configuration Tuning, parameter, MUS Select & LUT
  • Small Area
  • Field Update Flexibility
  • Product Customization
RF/Analog IC, CMOS Image Sensor,MEMS, LCD Display Manufacturing & Usability Trim & Calibration, Pixel repair
  • Small Area
  • On-board Programmable
  • Low Current
Industrial, Automotive MCU Code Storage Boot Code/Firmware Storage, Patch ROM code
  • Small Area
  • Field Update Flexibility
  • Minimize Re-spin Cost
  • Reliability
  • No Extra Board Space

Security Key for Digital Media, Wireless I/O

security key for digital media and wireless I/O

 

Security keys for digital media and wireless I/O is the dominant market for XPM technology so far. The NV data stored in an XPM cell is virtually impervious to detection since no voltage, or electronic or magnetic fields are stored.

  • Hacker proof for unique key storage
    • HDCP/DTCP key for digital content protection in consumer digital entertainment
    • Secure software boot and IMEI/DRM protection in mobile applications
  • Small area enables multi-time programming usage
  • Proven secure use in STB applications

Replacing Flash/EEPROM with OTP NVM

replacing flash with otp

 

The embedded MCU designs benefit greatly from the inclusion of on-chip embedded high density NVM memory blocks for field programmable firmware storage.

  • Cost-effective for product line customization
  • Masked ROM Patch for field update ability
  • Adds Security
  • Small form factor

CIS Yield Improvement

CIS Yield Improvement

 

Integration of image sensor with ISP and advancements in pixel technology increases the need for XPM to tweak and tune image sensor to provide consistency across modules.

  • Requirement: < 1Mb, but low power
  • Why is it critical?
    • Improve CIS GM by up to 15% through OTP
    • Higher pixel count means higher yield/repair needs