<?xml version="1.0" encoding="UTF-8"?>
<rss version="2.0"
	xmlns:content="http://purl.org/rss/1.0/modules/content/"
	xmlns:wfw="http://wellformedweb.org/CommentAPI/"
	xmlns:dc="http://purl.org/dc/elements/1.1/"
	xmlns:atom="http://www.w3.org/2005/Atom"
	xmlns:sy="http://purl.org/rss/1.0/modules/syndication/"
	xmlns:slash="http://purl.org/rss/1.0/modules/slash/"
	>

<channel>
	<title>Kilopass: Embedded One-Time Programmable Non-Volatile Memory IP, OTP NVM</title>
	<atom:link href="http://www.kilopass.com/feed/" rel="self" type="application/rss+xml" />
	<link>http://www.kilopass.com</link>
	<description>NVM IP. Worth Every Bit.</description>
	<lastBuildDate>Wed, 16 May 2012 19:31:32 +0000</lastBuildDate>
	<generator>http://wordpress.org/?v=2.9.2</generator>
	<language>en</language>
	<sy:updatePeriod>hourly</sy:updatePeriod>
	<sy:updateFrequency>1</sy:updateFrequency>
			<item>
		<title>Kilopass NVM IP Cores Deliver Footprint and Pin Compatibility</title>
		<link>http://www.kilopass.com/kilopass-nvm-ip-cores-deliver-footprint-and-pin-compatibility/</link>
		<comments>http://www.kilopass.com/kilopass-nvm-ip-cores-deliver-footprint-and-pin-compatibility/#comments</comments>
		<pubDate>Wed, 16 May 2012 19:31:32 +0000</pubDate>
		<dc:creator>Jmcleod</dc:creator>
				<category><![CDATA[Article]]></category>

		<guid isPermaLink="false">http://www.kilopass.com/?p=3429</guid>
		<description><![CDATA[As the use of NVM memories increases significantly, companies need to be assured of reliable second source options. Kilopass now has qualified eight different semiconductors suppliers who can assure footprint and pin compatibility for its devices fabricated at the 130/110 node.
Kilopass Technology Inc allows SoC designers to select any hard IP core-IP supplied as GDSII [...]]]></description>
			<content:encoded><![CDATA[<p>As the use of NVM memories increases significantly, companies need to be assured of reliable second source options. Kilopass now has qualified eight different semiconductors suppliers who can assure footprint and pin compatibility for its devices fabricated at the 130/110 node.</p>
<p>Kilopass Technology Inc allows SoC designers to select any hard IP core-IP supplied as GDSII hard macro-from the entire library of Kilopass XPM (eXtra Permanent Memory) and Gusto NVM IP, drop it into a design for fabrication at any of eight top-tier foundries at the 130/110nm node.</p>
<p>For the complete article, <a href="http://www.gabeoneda.com/news/kilopass-nvm-ip-cores-deliver-footprint-and-pin-compatibility">click here</a>.</p>
]]></content:encoded>
			<wfw:commentRss>http://www.kilopass.com/kilopass-nvm-ip-cores-deliver-footprint-and-pin-compatibility/feed/</wfw:commentRss>
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		</item>
		<item>
		<title>EDA/IP Weekly Roundup – May 16th</title>
		<link>http://www.kilopass.com/edaip-weekly-roundup-%e2%80%93-may-16th/</link>
		<comments>http://www.kilopass.com/edaip-weekly-roundup-%e2%80%93-may-16th/#comments</comments>
		<pubDate>Wed, 16 May 2012 19:27:40 +0000</pubDate>
		<dc:creator>Jmcleod</dc:creator>
				<category><![CDATA[Article]]></category>

		<guid isPermaLink="false">http://www.kilopass.com/?p=3425</guid>
		<description><![CDATA[Kilopass Technology has announced that SoC designers can select any hard IP core­IP supplied as GDSII hard macro­from the entire library of Kilopass XPM (eXtra Permanent Memory) and Gusto NVM IP, drop it into a design for fabrication at any of eight top-tier foundries at the 130/110nm node. Kilopass’ NVM IP common implementation for the [...]]]></description>
			<content:encoded><![CDATA[<p>Kilopass Technology has announced that SoC designers can select any hard IP core­IP supplied as GDSII hard macro­from the entire library of Kilopass XPM (eXtra Permanent Memory) and Gusto NVM IP, drop it into a design for fabrication at any of eight top-tier foundries at the 130/110nm node. Kilopass’ NVM IP common implementation for the eight top-tier silicon foundries at the 130/110nm process node means designers can use the same interface and achieve the same area at all of the eight foundries at 130/110nm, thus making foundry mobility simpler than before.</p>
]]></content:encoded>
			<wfw:commentRss>http://www.kilopass.com/edaip-weekly-roundup-%e2%80%93-may-16th/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
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		<item>
		<title>Kilopass NVM IP Cores First to Deliver Footprint and Pin Compatibility Across Eight Top-Tier Silicon Foundries for the 130/110nm Process Node</title>
		<link>http://www.kilopass.com/kilopass-nvm-ip-cores-first-to-deliver-footprint-and-pin-compatibility-across-eight-top-tier-silicon-foundries-for-the-130110nm-process-node/</link>
		<comments>http://www.kilopass.com/kilopass-nvm-ip-cores-first-to-deliver-footprint-and-pin-compatibility-across-eight-top-tier-silicon-foundries-for-the-130110nm-process-node/#comments</comments>
		<pubDate>Tue, 15 May 2012 13:46:52 +0000</pubDate>
		<dc:creator>Jmcleod</dc:creator>
				<category><![CDATA[Press Release]]></category>

		<guid isPermaLink="false">http://www.kilopass.com/?p=3419</guid>
		<description><![CDATA[Common Implementation Assures Foundry Mobility at 130/110nm
Process Node for Entire Kilopass XPMTM and GustoTM NVM IP Product
SANTA CLARA, Calif., May 15, 2012 – Kilopass Technology Inc., a leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), today announced that SoC designers can select any hard IP core—IP supplied as GDSII hard macro—from the [...]]]></description>
			<content:encoded><![CDATA[<p style="text-align: center;">C<em>ommon Implementation Assures Foundry Mobility at 130/110nm<br />
Process Node for Entire Kilopass XPMTM and GustoTM NVM IP Product</em></p>
<p><strong>SANTA CLARA, Calif., May 15, 2012</strong> – Kilopass Technology Inc., a leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), today announced that SoC designers can select any hard IP core—IP supplied as GDSII hard macro—from the entire library of Kilopass XPM (eXtra Permanent Memory) and Gusto NVM IP, drop it into a design for fabrication at any of eight top-tier foundries at the 130/110nm node. Kilopass’ NVM IP common implementation for the eight top-tier silicon foundries at the 130/110nm process node means designers can use the same interface and achieve the same area at all of the eight foundries at the 130/110nm, thus making foundry mobility far simpler than before.</p>
<p>&#8220;In the past, it might have been possible to move a design from one foundry to another but the size and interface of the NVM IP block would vary from one foundry’s process to another. Designers would need to tweak the interface, and accept or redesign for differences in area that individual foundry 130/110nm processes produced,” said Lee Cleveland, vice president of engineering at Kilopass Technology Inc. “Kilopass has developed a common implementation at the 130/110nm node that allows all our XPM and Gusto NVM IP cores to be fabricated at any of eight top-tier silicon foundries and deliver the same area using the same interface at each.&#8221;</p>
<p>The 2T CMOS anti fuse bit cell enabling Kilopass’ common implementation is fabricated in standard CMOS logic process technology without requiring additional process steps or design rule waivers. Given the maturity of the 130/110nm process, the physical design kits (PDK) are industrial baseline thus enabling ease of footprint and pin compatibility across eight foundries while each foundry’s GDSII remains unique. Kilopass has ported XPM embedded NVM and Gusto high-density memory to over 40 processes from 180nm to 28nm at pure play foundries and IDMs. To ensure over 10 years of reliable product operation, Kilopass 2T bit cell undergoes comprehensive high-temperature operating life (HTOL) and high temperature storage life (HTSL) qualification testing. Kilopass NVM IP offerings in 130/110nm include 16-bit register files and 1kb to 128kb XPM IP blocks, and 256Kb to 2Mb Gusto blocks to fit a wide variety of applications from securely storing copy protection algorithms, security codes, and encryption keys to IP addresses, analog/mixed signal trimming data, and boot code storage.</p>
<p>“No other NVM IP vendor enables the breadth of NVM IP hard cores over as many pure play foundries as Kilopass at the 130/110nm node,” said Linh Hong, vice president of marketing and sales at Kilopass. “We are seeing more multi-foundry strategies deployed by our customers to ensure supply even during foundries’ high-capacity periods as well as maintaining cost competitiveness. In addition to delivering high-quality and reliable logic CMOS embedded NVM to our customers, Kilopass’ common implementation platform in 130/110nm enables our customers the flexibility without the added cost of reworking the NVM IP to meet their multi-foundry needs.”</p>
<p><strong>Pricing &amp; Availability</strong><br />
Kilopass 16-bit XPM register files, 1kb to 128kb XPM IP blocks, and 512kb to 2Mb Gusto blocks are available for eight top tier silicon foundries at the 130/110nm node. Contact info@kilopass.com for pricing; a list of the foundries where Kilopass products are available; and for information on availability for the 180nm node at the eight top-tier foundries.</p>
<p><strong>About Kilopass</strong><br />
Kilopass Technology, Inc., a leading supplier of embedded NVM intellectual property, leverages standard logic CMOS processes to deliver one-time programmable (OTP) and many-time programmable (MTP) memory. With 58 patents granted or pending and more than 800,000 wafers shipped from a dozen foundries and Integrated Device Manufacturers (IDM), Kilopass has more than 100 customers in applications ranging from storage of firmware and security codes to calibration data and other application-critical information. The company is headquartered in Santa Clara, Calif. For more information, visit www.kilopass.com or email info@kilopass.com. Follow Kilopass on Twitter at http://twitter.com/#!/Kilopass_.</p>
<p style="text-align: center;">###</p>
<p><em>Gusto, XPM and XPM Xtend are trademarks of Kilopass Technology Inc. All other tradenames and trademarks are the property of their respective holders.</em></p>
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		<title>Discussion on 3-D Packaging Addresses Costs</title>
		<link>http://www.kilopass.com/discussion-on-3-d-packaging-addresses-costs/</link>
		<comments>http://www.kilopass.com/discussion-on-3-d-packaging-addresses-costs/#comments</comments>
		<pubDate>Mon, 14 May 2012 20:30:30 +0000</pubDate>
		<dc:creator>Jmcleod</dc:creator>
				<category><![CDATA[Article]]></category>

		<guid isPermaLink="false">http://www.kilopass.com/?p=3415</guid>
		<description><![CDATA[In a commentary dated May 9th in EE Life that you can read at http://bit.ly/KbmGUc Andre Hassan of Kilopass casts serious doubts about the viability of 3-D packaging. The article looks at the practical obstacles in matching a memory die produced by a supplier with a logic die produced by a different one. Without a [...]]]></description>
			<content:encoded><![CDATA[<p>In a commentary dated May 9th in EE Life that you can read at <a href="http://bit.ly/KbmGUc">http://bit.ly/KbmGUc</a> Andre Hassan of Kilopass casts serious doubts about the viability of 3-D packaging. The article looks at the practical obstacles in matching a memory die produced by a supplier with a logic die produced by a different one. Without a doubt the author has a point. Too often, especially from EDA vendors, we hear that the industry is moving rapidly toward 3-D and that the acceptance of the method depends only on design technology and, of course, the expensive tools that go with it.</p>
<p>For the complete article, <a href="http://www.gabeoneda.com/silicon-beach/discussion-3-d-packaging-addresses-costs">click here</a>.</p>
]]></content:encoded>
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		<item>
		<title>Driving a stake into the heart of the 3-D packaging hype</title>
		<link>http://www.kilopass.com/driving-a-stake-into-the-heart-of-the-3-d-packaging-hype/</link>
		<comments>http://www.kilopass.com/driving-a-stake-into-the-heart-of-the-3-d-packaging-hype/#comments</comments>
		<pubDate>Wed, 09 May 2012 16:06:50 +0000</pubDate>
		<dc:creator>Jmcleod</dc:creator>
				<category><![CDATA[Article]]></category>

		<guid isPermaLink="false">http://www.kilopass.com/?p=3409</guid>
		<description><![CDATA[The latest entry in Wikipedia, &#8220;Three-dimensional integrated circuit,&#8221; would lead you to believe that there is a renaissance about to happen in the art of building 3D packaging: Chip Stack or multi-chip module (MCM). The euphoria has been further fueled by articles such as &#8220;Chip execs see 20 nm variants, 3-D ICs ahead&#8221;  in a [...]]]></description>
			<content:encoded><![CDATA[<p>The latest entry in Wikipedia, &#8220;Three-dimensional integrated circuit,&#8221; would lead you to believe that there is a renaissance about to happen in the art of building 3D packaging: Chip Stack or multi-chip module (MCM). The euphoria has been further fueled by articles such as &#8220;Chip execs see 20 nm variants, 3-D ICs ahead&#8221;  in a recent issue of EE Times.</p>
<p>Much of this wishful thinking, hyped by commodity memory manufacturers, can be attributed to the old adage that &#8220;those who do not learn from history shall be compelled to re-live it.&#8221;</p>
<p>For the complete article, <a href="http://www.eetimes.com/discussion/other/4372598/Driving-a-stake-into-the-heart-of-the-3-D-packaging-hype?pageNumber=0">click here</a>.</p>
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		<item>
		<title>MemoryPill &#8211; March 2012</title>
		<link>http://www.kilopass.com/memorypill-march-2012/</link>
		<comments>http://www.kilopass.com/memorypill-march-2012/#comments</comments>
		<pubDate>Mon, 07 May 2012 17:51:31 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[MemoryPill Issue]]></category>

		<guid isPermaLink="false">http://www.kilopass.com/?p=3405</guid>
		<description><![CDATA[The Silver Lining Around the Dark Cloud of Semiconductor Investing
Resistive RAM: The Future Embedded Non-Volatile Memory?
]]></description>
			<content:encoded><![CDATA[<h2 class="left cufon-pill"><a href="/the-silver-lining-around-the-dark-cloud-of-semiconductor-investing/">The Silver Lining Around the Dark Cloud of Semiconductor Investing</a></h2>
<h2 class="right cufon-pill"><a href="/resistive-ram-the-future-embedded-non-volatile-memory/">Resistive RAM: The Future Embedded Non-Volatile Memory?</a></h2>
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		<title>MemoryPill &#8211; January 2012</title>
		<link>http://www.kilopass.com/memorypill-january-2012/</link>
		<comments>http://www.kilopass.com/memorypill-january-2012/#comments</comments>
		<pubDate>Mon, 07 May 2012 17:49:38 +0000</pubDate>
		<dc:creator>admin</dc:creator>
				<category><![CDATA[MemoryPill Issue]]></category>

		<guid isPermaLink="false">http://www.kilopass.com/?p=3403</guid>
		<description><![CDATA[For 2012, Power, Japan, and Packaging Represents Semiconductor Opportunity
MEMS Sensors Drive NVM Demand in Real World
]]></description>
			<content:encoded><![CDATA[<h2 class="left cufon-pill"><a title="For 2012, Power, Japan, and Packaging Represents Semiconductor Opportunity" href="http://www.kilopass.com/for-2012-power-japan-and-packaging-represents-semiconductor-opportunity/">For 2012, Power, Japan, and Packaging Represents Semiconductor Opportunity</a></h2>
<h2 class="right cufon-pill"><a title="MEMS Sensors Drive NVM Demand in Real World" href="http://www.kilopass.com/mems-sensors-drive-nvm-demand-in-real-world/">MEMS Sensors Drive NVM Demand in Real World</a></h2>
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		<title>TSMC 2012 Japan Technology Symposium Yokohama</title>
		<link>http://www.kilopass.com/tsmc-2012-japan-technology-symposium-yokohama/</link>
		<comments>http://www.kilopass.com/tsmc-2012-japan-technology-symposium-yokohama/#comments</comments>
		<pubDate>Fri, 27 Apr 2012 21:45:59 +0000</pubDate>
		<dc:creator>Jmcleod</dc:creator>
				<category><![CDATA[Event]]></category>

		<guid isPermaLink="false">http://www.kilopass.com/?p=3400</guid>
		<description><![CDATA[Visit Kilopass at the 2012 TSMC 2012 Japan Technology Symposium Yokohama in the Pan Pacific Yokohama Bay Hotel Tokyu, 2-3-7, Minato Mirai, Nishi-ku, Yokohama, Kanagawa, Japan 220-8543.  To schedule a meeting with a member of our sales team, please email sales@kilopass.com.
For more event information, please visit the TSMC event website.
]]></description>
			<content:encoded><![CDATA[<p>Visit Kilopass at the 2012 TSMC 2012 Japan Technology Symposium Yokohama in the Pan Pacific Yokohama Bay Hotel Tokyu, 2-3-7, Minato Mirai, Nishi-ku, Yokohama, Kanagawa, Japan 220-8543.  To schedule a meeting with a member of our sales team, please email <a href="mailto:sales@kilopass.com">sales@kilopass.com</a>.</p>
<p>For more event information, please visit the <a href="http://www.tsmc.com/english/newsEvents/events.htm#symp">TSMC event website</a>.</p>
]]></content:encoded>
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		<slash:comments>0</slash:comments>
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		<title>2012 TSMC Israel Technology Symposium Tel Aviv</title>
		<link>http://www.kilopass.com/2012-tsmc-israel-technology-symposium-tel-aviv/</link>
		<comments>http://www.kilopass.com/2012-tsmc-israel-technology-symposium-tel-aviv/#comments</comments>
		<pubDate>Thu, 26 Apr 2012 20:08:05 +0000</pubDate>
		<dc:creator>Jmcleod</dc:creator>
				<category><![CDATA[Event]]></category>

		<guid isPermaLink="false">http://www.kilopass.com/?p=3395</guid>
		<description><![CDATA[Visit Kilopass at the 2012 TSMC Israel Technology Symposium Tel Aviv in the Dan Panorama Tel Avi, S10 Kaufman St. Tel Aviv, 68012, Israel. To schedule a meeting with a member of our sales team, please email sales@kilopass.com.
For more event information, please visit the TSMC event website.
]]></description>
			<content:encoded><![CDATA[<p>Visit Kilopass at the 2012 TSMC Israel Technology Symposium Tel Aviv in the Dan Panorama Tel Avi, S10 Kaufman St. Tel Aviv, 68012, Israel. To schedule a meeting with a member of our sales team, please email <a href="mailto:sales@kilopass.com">sales@kilopass.com</a>.</p>
<p>For more event information, please visit the <a href="http://www.tsmc.com/english/newsEvents/events.htm#symp">TSMC event website.</a></p>
]]></content:encoded>
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		<slash:comments>0</slash:comments>
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		<title>2012 TSMC Europe Technology Symposium Amsterdam</title>
		<link>http://www.kilopass.com/2012-tsmc-europe-technology-symposium-amsterdam/</link>
		<comments>http://www.kilopass.com/2012-tsmc-europe-technology-symposium-amsterdam/#comments</comments>
		<pubDate>Thu, 26 Apr 2012 17:40:07 +0000</pubDate>
		<dc:creator>Jmcleod</dc:creator>
				<category><![CDATA[Event]]></category>

		<guid isPermaLink="false">http://www.kilopass.com/?p=3390</guid>
		<description><![CDATA[Visit Kilopass at the 2012 TSMC Europe Technology Symposium Amsterdam in the Sheraton Amsterdam airport hotel, Schiphol Boulevard 101, 1118 BG Schiphol, The Netherlands. To schedule a meeting with a member of our sales team, please email sales@kilopass.com.
For more event information, please visit the TSMC event website.
]]></description>
			<content:encoded><![CDATA[<p>Visit Kilopass at the 2012 TSMC Europe Technology Symposium Amsterdam in the Sheraton Amsterdam airport hotel, Schiphol Boulevard 101, 1118 BG Schiphol, The Netherlands. To schedule a meeting with a member of our sales team, please email <a href="mailto:sales@kilopass.com">sales@kilopass.com</a>.</p>
<p>For more event information, please visit the <a href="http://www.tsmc.com/english/newsEvents/events.htm#symp">TSMC event website</a>.</p>
]]></content:encoded>
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		</item>
	</channel>
</rss>

