Chief Executive Officer
Charlie Cheng joined Kilopass as CEO in October 2008. His career spans more than 15 years of experience in the semiconductor IP industry. Prior to Kilopass, he served as vice president of marketing and international business at Faraday Technology, where he grew the Taiwan-centric company into an international presence. Previously, he was co-founder and CEO of Lexra Inc., an embedded RISC CPU IP company. Charlie began his technology career at General Electric and IBM, and pioneered in the semiconductor IP business as VP of Marketing at Aspec Technology. He also served in various technical and management positions at Iomega, Zycad and Viewlogic. He holds a Bachelor of Science degree in Computer Science and Mechanical Engineering from Cornell University, Ithaca, NY.
Chief Technical Officer and Vice President of Research & Development
Harry Luan has been with Kilopass since its inception in 2002. He has over 20 years of experience with a strong background in VLSI semiconductor process technology, integration, device engineering, product reliability, and product qualification. He is an expert in CMOS/NVM memory device physics, modeling, optimization, and characterization for technology development, yield enhancement, and failure analysis. Harry served for six years at Kilopass as Director of Technology Development before assuming the role of chief technology officer in May, 2009. Prior to joining Kilopass, Harry Luan held various technical and management positions at AMD, Hynix, Cypress, and Winbond. He made key contributions in research and development of non-volatile memory and logic technologies including EPROM, EEPROM, FLASH, SONOS, R-RAM, and CPLD. Dr. Luan obtained his Ph.D. in Electrical Engineering from Purdue University.
Chief Operating Officer
James T. Lindstrom is the Chief Operating Officer (COO) of Kilopass Technology. His 30 years high-tech corporate finance career began in international finance at Fairchild Semiconductor. Since then he has driven development and financing of many Silicon Valley companies, including Cadence, C-Cube Microsystems, FormFactor, Trident Microsystems and eSilicon. Jim led the IPOs of ECAD and Trident Microsystems and has extensive understanding of mergers and acquisitions having played an integral role in the formation of Cadence Design Systems from ECAD and SDA Systems and the acquisition of Silicon Perspective Corporation by Cadence. Currently a member of the board of directors of Semtech Corporation, Jim serves as chair of the company’s audit committee. A graduate of U.C. Berkeley, he holds an MBA in Finance and Business Economics from the University of Southern California.
Vice President of Engineering
Dr. Hsu’s diverse semiconductor industry experience includes semiconductor process technology, flash memory technology, system-on-chip (SoC) development, High-Speed I/O, and IP. Most recently, he was Vice President of Engineering at Pericom Semiconductor Corporation. Before that, at Global Unichip Corporation (GUC), he was in charge of the overall IP business and development. At Intel Corporation, Dr. Hsu held senior management and project lead positions in both design engineering as well as product engineering for high-speed SerDes projects in chipset products and flash memory. He began his career at National Semiconductor as a senior process integration engineer. Dr. Hsu holds more than a dozen U.S. patents and has published extensively in the field of semiconductor physics and analog/mixed signal circuit design. He received a Ph.D. in Electrical Engineering from the University of California, Los Angeles (UCLA), a Master of Science degree in Electrical Engineering from Case Western Reserve University in Cleveland, Ohio, and a Bachelor of Science degree in Electrical Engineering from National Taiwan University in Taipei, Taiwan.
Vice President of Sales
Linh Hong is VP of Sales at Kilopass responsible for Kilopass’ solutions globally. With 16 years of solid semiconductor industry experience – primarily focused on logic NVM IP, high-speed SERDES IP and broadband communication ASICs – Linh served for three years in various director and management positions in field applications engineering and applications marketing at Kilopass before assuming her current role in April 2009. Prior to joining Kilopass, she was a design consultant and design manager at LSI Logic, where she also served in various design and marketing engineering functions. She began her career as a component engineer at Sun Microsystems. Linh holds a BS degree with honors in physics, and an MSEE degree in electrical engineering, both from University of California, Davis.
Vice President of Field Applications Engineering
Bernd Stamme is Vice President of Field Applications Engineering at Kilopass Technology. He has more than 20 years of experience in the IP and semiconductor industry. Prior to Kilopass, he was the Director of IP Technology at SiRF Technology managing the licensing and successful integration of 3rd party IP into SiRF’s GPS chipsets. Before SiRF, he held management positions in LSI Logic’s CoreWare organization and worked on high speed SerDes IP, communication interfaces and processor cores. Bernd holds a Dipl.-Ing. degree in Electrical Engineering from FH Bielefeld in Germany